Robots at CES 2018: Depth Sensors


They were demonstrating a small Depth Sensor that uses MEMs technology.
They also have a MEMs Structured Light Generator and MEMs Scanning Mirror Module.

Fig. 1:

Human+ (Humanplus Intelligent Robotics Technology Co. Ltd)

Their “MoveSense SKY Pro” is a stereo camera designed for UAVs, but could probably be used for other types of robots.
They also have the “MAKE Pro”, which has a light projector for active stereo, and the “PIONEER” which is a 4-directional stereo camera designed to mount on a UAV.
Website: (in Chinese)

Their SDK is on Github:

Some old videos of their depth sensor:

A paper that uses the MoveSense depth sensor:
Wang et al., “A Depth Camera Based Lightweight Visual SLAM Algorithm”, ICSAI 2017 PDF

Fig. 2:

Fig. 3:

Guardian Optical Technologies

They were demonstrating a sensor for inside vehicles, designed to detect the presence of people.
It has a 3D sensor (camera) that goes near the dome light in your car and additional IR light projectors above the 4 doors. If you divide the seating area into 2D cells of space, the sensor can detect the presence of a person and measure the distance (depth) in that part of space. Given that the sensor could detect me when I was not moving, my guess is that they’re using either thermal IR or a technique called “video magnification”.

Fig. 4:

Fig. 5:
Output from the sensor.


They were demonstrating their TOF sensor ICs (upto 320×240 resolution) and computer vision algorithms.

Fig. 6:
The Opnous booth.

Fig. 7:
Close-up of sensor die
(integrated circuits).

Fig. 8:
Demo of a TOF camera.

Fig. 9:
Close-up of demo laptop

Fig. 10:
Close-up of TOF camera.

Fig. 11:
Information slides:
“The TOF to present”
5fps to 120fps

Fig. 12:
Information slides:
“Opnous provide the full
TOF IC & System Solution”

Fig. 13:
Information slides:
“Smart sensing, 3D sensing
support smart IOT solutions”


They were advertising their Structure Core depth sensor module for OEMs and developers.
They also had the PX-80 3D mapping sensor, which was developed by their recently-acquired company Paracosm.

Fig. 14:
“Next-generation SLAM ready
for integration”.

Fig. 15:
Specifications of the
Structure sensor.

Fig. 16:
Paracosm PX-80
“Limitless 3D mapping”.

Fig. 17:
Close-up of the Structure
sensor module.